Tekwarm Lite LP UFH Board – Low-Profile Heating solution
A robust, cement-coated XPS insulation board designed for quick, low-build underfloor heating
The Tekwarm Lite LP UFH Board is a high-compressive strength (300 kPa) insulated panel, engineered for efficient low-profile underfloor heating systems. At just 20mm thick, it provides excellent thermal performance while keeping build-up to a minimum – making it ideal for projects where floor height is restricted.
Each board measures 1200 x 600mm and comes with precision grooves to accommodate 12mm or 16mm UFH pipework, including radius returns as standard. Alternative pipe layouts and bespoke routing patterns are available on request, offering flexibility for a wide range of installation requirements.
The durable cementitious coating on both faces allows for the direct application of tiles or wood flooring (on underlay), while other finishes can be supported with a Tekwarm Construction Board layer. Easy to fix onto both timber (using mechanical fixings) and concrete (with tile adhesive), the boards ensure a fast, reliable installation with minimal disruption.
Whether for domestic renovations or large-scale commercial builds, Tekwarm Lite LP UFH Boards deliver consistent heat output, quick installation, and lasting durability.
